This is a practical guide to Surface Science for researchers working in the Semiconductors Industry.
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Semiconductor manufacturers face the constant challenge of maximizing performance and refining processes. Often underestimated, surface properties play a crucial role in optimizing these performances. By measuring these properties, we gain valuable insights into material properties, processes, and device performance, ultimately leading to:
We use the following surface properties to understand the behavior of Semiconductors products and improve their quality.
Sample Image taken from Droplet Lab Tensiometer.
Joven – Método Laplace
Método polinómico
Ideally, when we place a drop on a solid surface, a unique angle exists between the liquid and the solid surface. We can calculate the value of this ideal contact angle (the so-called Young’s contact angle) using Young’s equation. In practice, due to surface geometry, roughness, heterogeneity, contamination, and deformation, the contact angle value on a surface is not necessarily a single consistent value but rather falls within a range. The upper and lower limits of this range are known as the advancing and receding contact angles, respectively. The values of advancing and receding contact angles for a solid surface are highly sensitive to many parameters, such as temperature, humidity, homogeneity, and minor contamination of the surface and liquid. For example, the advancing and receding contact angles of a surface can differ at different locations.
Las superficies y los recubrimientos prácticos muestran naturalmente histéresis de ángulo de contacto, lo que indica un rango de valores de equilibrio. Cuando medimos ángulos de contacto estáticos, obtenemos un solo valor dentro de este rango. Confiar únicamente en mediciones estáticas plantea problemas, como una repetibilidad deficiente y una evaluación incompleta de la superficie con respecto a la adherencia, la limpieza, la rugosidad y la homogeneidad.
In practical applications, we need to understand how easily a liquid spreads (advancing angle) and how easily it is removed (receding angle), such as in painting and cleaning. Measuring advancing and receding angles offers a holistic view of liquid-solid interaction, unlike static measurements, which yield an arbitrary value within the range.
Esta información es crucial para las superficies del mundo real con variaciones, rugosidad y dinámica, lo que ayuda a industrias como la cosmética, la ciencia de los materiales y la biotecnología a diseñar superficies efectivas y optimizar los procesos.
Aprenda cómo se realiza la medición del ángulo de contacto en nuestro tensiómetro
Para una comprensión más completa de la medición del ángulo de contacto, lea nuestra medición del ángulo de contacto: la guía definitiva
These reference measurements show how deionized water wets four standard substrates measured with the Droplet Lab Dropometer. Use them as visual and numerical benchmarks when you're checking your own sample preparation, treatments, and chemistry.
Full contact angle and surface energy datasets (including additional liquids and statistics) are available on our dataset hub.
The droplet images above are taken from the same benchmark series as our open dataset. For each substrate and probe liquid we report:
● Advancing and receding contact angles (and hysteresis)
● Derived surface energy (SFE) values based on multi-liquid measurements
● Measurement conditions, uncertainties, and sample preparation details
Comparing your own droplet shapes and angles against these references is a fast way to spot contamination, treatment drift, or unexpected changes in wettability.
Esta propiedad mide la fuerza que actúa sobre la superficie de un líquido, con el objetivo de minimizar su superficie.
Sample Image taken from Droplet Lab Tensiometer
Tensión superficial dinámica
La tensión superficial dinámica difiere de la tensión superficial estática, que se refiere a la energía superficial por unidad de área (o fuerza que actúa por unidad de longitud a lo largo del borde de una superficie líquida).
La tensión superficial estática caracteriza el estado de equilibrio de la interfaz líquida, mientras que la tensión superficial dinámica explica la cinética de los cambios en la interfaz. Estos cambios podrían implicar la presencia de tensioactivos, aditivos o variaciones en la temperatura, la presión y la composición en la interfaz.
Cuándo utilizar la medición dinámica de la tensión superficial
Dynamic surface tension is essential for processes that involve rapid changes at the liquid-gas or liquid-liquid interface, such as droplet and bubble formation, coalescence (change in surface area), the behavior of foams, and the drying of paints (change in composition, e.g., evaporation of solvent). It is measured by analyzing the shape of a hanging droplet over time.
La tensión superficial dinámica se aplica a diversas industrias, incluidas las cosméticas, los recubrimientos, los productos farmacéuticos, la pintura, los alimentos y las bebidas, y los procesos industriales, donde la comprensión y el control del comportamiento de las interfaces líquidas son esenciales para la calidad del producto y la eficiencia del proceso.
Aprenda cómo se realiza la medición de la tensión superficial en nuestro tensiómetro
Para una comprensión más completa de la medición de la energía superficial, lea nuestra medición de la tensión superficial: la guía definitiva
Sample Image taken from Droplet Lab Tensiometer
Aprenda cómo se realiza la medición de la energía superficial en nuestro tensiómetro
Para una comprensión más completa de la medición de la energía superficial, lea nuestra medición de la energía superficial: la guía definitiva
For benchmark contact angle and surface energy values on glass, nylon, PMMA, and Teflon, see the Open Benchmark Data panel above or visit our Dataset Hub for full CSV downloads.
El ángulo de deslizamiento mide el ángulo en el que una película líquida se desliza sobre una superficie sólida. Se emplea comúnmente para evaluar la resistencia al deslizamiento de una superficie.
Sample Image taken from Droplet Lab Tensiometer
Aprenda cómo se realiza la medición del ángulo de deslizamiento en nuestro tensiómetro
Para una comprensión más completa de la medición del ángulo de deslizamiento, lea nuestra medición del ángulo de deslizamiento: la guía definitiva
Within the Semiconductors industry, several case studies exemplify the advantages of conducting surface property measurements.
In photolithography, meticulous pattern creation is key to manufacturing complex semiconductor devices. This process relies heavily on the delicate interplay between the photoresist and the substrate. Photoresist adhesion to the substrate acts as a linchpin, directly determining the sharpness and precision of the resulting patterns. To achieve optimal results, manufacturers delve into the surface science of these properties. By examining the substrate's surface energy and analyzing the contact angle exhibited by the photoresist, they gain valuable insights to fine-tune adjustments.
This refining process enhances adhesion properties, ultimately leading to a seamless pattern transfer. The benefits are manifold, including increased yields, sharper results, and a significant reduction in defects throughout the lithography process.
Chip packaging relies heavily on adhesives to securely bind the delicate semiconductor die to its protective casing. However, a major challenge arises from leftover adhesive residue, which can negatively impact device reliability.
To combat this issue, manufacturers meticulously measure and manage the sliding angle of the packaging material during application. This precise control ensures that the liquid adhesive smoothly glides away, leaving no unwanted residue behind. This optimization delivers two key benefits: firstly, it significantly reduces the risk of electrical shorts or unintended connections, and secondly, it effectively boosts the overall electrical performance of the device.
To achieve successful immersion lithography, meticulous management of the immersion fluid is crucial. A major failure point is the receding meniscus event, which leaves residual liquid behind on the wafer as a thin film or droplets. Ideally, the immersion fluid should be confined near the lens, allowing the wafer to scan smoothly during exposure.
For a semiconductor manufacturer, the meniscus failure mechanism remained a significant hurdle, hindering the successful implementation of immersion lithography. Recognizing the critical role of surface forces in drainage and pattern collapse during lithography, they sought a solution from a laboratory. The scientists, understanding the importance, developed a new fluid formulation with precisely tailored surface tension characteristics that facilitated proper liquid drainage, eliminating the meniscus issue.
Si está interesado en implementar estas u otras aplicaciones, póngase en contacto con nosotros.
In an industry where precision reigns supreme, how can Semiconductors manufacturers ensure their products withstand scrutiny? The answer lies in standards and guidelines: the compass that guides them through the complex maze of quality and performance.
Standard practice for estimating a solid’s total surface free energy and separating it into dispersive and polar components by measuring sessile‑drop contact angles of two probe liquids (one polar, one non‑polar) of known surface tension on the surface. It is intended as a quantitative, comparative surface‑readiness metric for wetting/adhesion process control within an approximate applicable range of ~20–60 mN/m.
Use fixed‑time contact angles plus calculated γ components to confirm surface cleaning/treatment/priming is within a validated “pass band” before committing to downstream trials.
Trend γs,polar/γs,dispersive and spot‑to‑spot variability to diagnose under‑treatment, contamination, non‑uniform treatment, or material/lot shifts.
This method provides an image‑backed, quantitative surface‑readiness signal but does not by itself guarantee adhesion or print performance. Any pass/fail gates must be calibrated per material family + treatment recipe + ink/adhesive system by correlating D7490 outputs to your downstream KPI.
We hope this guide showed you how to apply surface science in the Semiconductors industry.
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