Diario
High-Performance and Safer Wet Stripper for 50 to 400 µm-Thick Negative Photoresists and Laminated Films in Wafer Level Packaging
Describes a new NMP-free and TMAH-free stripper for thick negative-tone photoresists (50 to 400 µm) and laminated films used to build copper pillars in wafer level packaging. Developed by screening ea...
View More